Dr. Sunhong Jun Profile

Dr. Sunhong Jun

at Samsung Electronics Co. Ltd.

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 5 June 2023 Presentation + Paper

Characterization of interface charge traps in PE-TEOS and HDP oxide with different annealing temperatures using time-dependent second-harmonic generation

Ingi Kim, Suhwan Park, Minhwan Seo, Sunhong Jun, Sungyoon Ryu, Sangwoo Bae, Namil Koo, Yusin Yang

Proceedings Volume 12569, 1256904 (2023) https://doi.org/10.1117/12.2657070

KEYWORDS: Oxides, Second harmonic generation, Interfaces, Annealing, Silicon, Electric fields, Electrical properties, Dielectrics, Silicon films, Wafer inspection

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Proceedings Article | 27 April 2023 Presentation + Paper

Semiconductor device metrology for detecting defective chip due to high aspect ratio-based structures using hyperspectral imaging and deep learning

Sunhong Jun, Wonjun Choi, DongHoon Kim, Hayan Park, Dongmin Kyeon, Kyounghwan Lee, Yong-Ju Jeon, Chaemin Lee, Kwangchul Kim, Jeongsu Ha, Sungyoon Ryu, Younghoon Son, Yongdeok Jung

Proceedings Volume 12496, 124961F (2023) https://doi.org/10.1117/12.2657062

KEYWORDS: Intelligence systems, Semiconducting wafers, Deep learning, 3D metrology, Hyperspectral imaging, Etching, Metrology, 3D modeling, Imaging spectroscopy, Defect detection

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Proceedings Article | 27 April 2023 Presentation + Paper

Detection of defective areas and hidden weak patterns in the wafer using massive measurement data

DongHoon Kim, Sungyoon Ryu, Sunhong Jun, Heeyoon Han, Wonjun Choi, Yong-Ju Jeon, Hyun Lee, Souk Kim, Younghoon Sohn

Proceedings Volume 12496, 124961Y (2023) https://doi.org/10.1117/12.2657064

KEYWORDS: Semiconducting wafers, Signal detection, Defect detection, Metrology, Signal processing, Semiconductors, Semiconductor manufacturing, Fourier transforms, Fabrication

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Proceedings Article | 26 May 2022 Presentation + Paper

A study on the detection and monitoring of weak areas in wafer using massive 2D and 3D measurement data

Sungyoon Ryu, Dong Hoon Kim, Sunhong Jun, Suho Ryu, JaeHyung Ahn, Hyun Lee, Kwang-Eun Kim, Yusin Yang, Younghoon Sohn

Proceedings Volume 12053, 1205302 (2022) https://doi.org/10.1117/12.2613631

KEYWORDS: Semiconducting wafers, 3D metrology, Inspection, Metrology, Ellipsometry, 3D modeling, Detection and tracking algorithms, Wafer-level optics, Semiconductors, Manufacturing

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