Dr. JaeHyung Ahn Profile

Dr. JaeHyung Ahn

at SAMSUNG Electronics Co Ltd

SPIE Involvement:

Author

Publications (6)

Proceedings Article | 10 April 2024 Presentation + Paper

3D gray level index for pattern depth monitoring based on SEM Image

Hyeon Bo Shim, Jaehyung Ahn, Inseok Park, Souk Kim, Younghoon Sohn

Proceedings Volume 12955, 1295511 (2024) https://doi.org/10.1117/12.3010209

KEYWORDS: Scanning electron microscopy, 3D image processing, 3D metrology, Design rules, Critical dimension metrology, Monte Carlo methods, Metrology, Manufacturing

Read Abstract +

Proceedings Article | 27 April 2023 Poster + Paper

3D measurement using SEM technology

Younghoon Sohn, JaeHyung Ahn, Inseok Park, Souk Kim, DongHoon Kim

Proceedings Volume 12496, 124963M (2023) https://doi.org/10.1117/12.2657478

KEYWORDS: Single crystal X-ray diffraction, Scanning electron microscopy, Critical dimension metrology, 3D metrology, Electron beams, Semiconducting wafers, Etching, Cadmium, Optical testing, Optical limiting

Read Abstract +

Proceedings Article | 27 April 2023 Poster + Paper

Local depth monitoring using scanning electron microscopy and its verification using atomic force microscopy

Inseok Park, JaeHyung Ahn, Donghyun Lee, Souk Kim, Minho Rim, Younghoon Sohn

Proceedings Volume 12496, 124962L (2023) https://doi.org/10.1117/12.2657848

KEYWORDS: Scanning electron microscopy, Atomic force microscopy, Transmission electron microscopy, Semiconducting wafers, Reliability, Metrology, Signal detection, Semiconductors, Optical transmission, Optical sensing

Read Abstract +

Proceedings Article | 26 May 2022 Presentation + Paper

Diversifying the role of MI in semiconductor manufacturing through new technologies and innovations

Younghoon Sohn, Sungyoon Ryu, Jaehyung Ahn, Souk Kim

Proceedings Volume 12053, 120530X (2022) https://doi.org/10.1117/12.2612710

KEYWORDS: Semiconductors, Inspection, Data processing, Semiconductor manufacturing, Scanning electron microscopy, New and emerging technologies, High volume manufacturing

Read Abstract +

Proceedings Article | 26 May 2022 Poster + Presentation + Paper

Depth measurement using high-voltage SEM that changes the inclination of the incident beam

JaeHyung Ahn, KwangEun Kim, Souk Kim, Younghoon Sohn

Proceedings Volume 12053, 1205324 (2022) https://doi.org/10.1117/12.2614186

KEYWORDS: Scanning electron microscopy, Tungsten, Electron microscopy, Etching, 3D metrology, Manufacturing, Error analysis

Read Abstract +

Proceedings Article | 26 May 2022 Presentation + Paper

A study on the detection and monitoring of weak areas in wafer using massive 2D and 3D measurement data

Sungyoon Ryu, Dong Hoon Kim, Sunhong Jun, Suho Ryu, JaeHyung Ahn, Hyun Lee, Kwang-Eun Kim, Yusin Yang, Younghoon Sohn

Proceedings Volume 12053, 1205302 (2022) https://doi.org/10.1117/12.2613631

KEYWORDS: Semiconducting wafers, 3D metrology, Inspection, Metrology, Ellipsometry, 3D modeling, Detection and tracking algorithms, Wafer-level optics, Semiconductors, Manufacturing

Read Abstract +

Showing 5 of 6 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years