Koichi Yatsuda
Group Leader at TEL
SPIE Involvement:
Author
Publications (10)

Proceedings Article | 20 March 2015 Paper
Mark Somervell, Takashi Yamauchi, Soichiro Okada, Tadatoshi Tomita, Takanori Nishi, Shinichiro Kawakami, Makoto Muramatsu, Etsuo Iijima, Vinayak Rastogi, Takeo Nakano, Fumiko Iwao, Seiji Nagahara, Hiroyuki Iwaki, Makiko Dojun, Koichi Yatsuda, Toshikatsu Tobana, Ainhoa Romo Negreira, Doni Parnell, Benjamen Rathsack, Kathleen Nafus, Jean-Luc Peyre, Takahiro Kitano
Proceedings Volume 9425, 94250Q (2015) https://doi.org/10.1117/12.2085776
KEYWORDS: Etching, Semiconducting wafers, Optical lithography, Polymethylmethacrylate, Line edge roughness, Manufacturing, Image processing, Ecosystems, Line width roughness, Directed self assembly

Proceedings Article | 27 March 2014 Paper
Mark Somervell, Takashi Yamauchi, Soichiro Okada, Tadatoshi Tomita, Takanori Nishi, Etsuo Iijima, Takeo Nakano, Takumi Ishiguro, Seiji Nagahara, Hiroyuki Iwaki, Makiko Dojun, Mariko Ozawa, Koichi Yatsuda, Toshikatsu Tobana, Ainhoa Romo Negreira, Doni Parnell, Shinchiro Kawakami, Makoto Muramatsu, Benjamen Rathsack, Kathleen Nafus, Jean-Luc Peyre, Takahiro Kitano
Proceedings Volume 9051, 90510N (2014) https://doi.org/10.1117/12.2045975
KEYWORDS: Semiconducting wafers, Etching, Polymethylmethacrylate, Thin film coatings, High volume manufacturing, Ecosystems, Lithography, Manufacturing, Manufacturing equipment, Directed self assembly

Proceedings Article | 29 March 2013 Paper
Werner Boullart, Dunja Radisic , Vasile Paraschiv, Sven Cornelissen, Mauricio Manfrini, Koichi Yatsuda, Eiichi Nishimura, Tetsuya Ohishi, Shigeru Tahara
Proceedings Volume 8685, 86850F (2013) https://doi.org/10.1117/12.2013602
KEYWORDS: Etching, Plasma, Plasma etching, Optical lithography, Ions, Wet etching, Ion beams, Magnetism, Chemistry, Tantalum

Proceedings Article | 29 March 2013 Paper
Proceedings Volume 8682, 86820K (2013) https://doi.org/10.1117/12.2012018
KEYWORDS: Etching, Polymethylmethacrylate, Manufacturing, Picosecond phenomena, Ecosystems, Semiconducting wafers, Inspection, Directed self assembly, Materials processing, Polymers

Proceedings Article | 21 March 2012 Paper
Benjamen Rathsack, Mark Somervell, Josh Hooge, Makoto Muramatsu, Keiji Tanouchi, Takahiro Kitano, Eiichi Nishimura, Koichi Yatsuda, Seiji Nagahara, Iwaki Hiroyuki, Keiji Akai, Takashi Hayakawa
Proceedings Volume 8323, 83230B (2012) https://doi.org/10.1117/12.916311
KEYWORDS: Etching, Semiconducting wafers, Line edge roughness, Picosecond phenomena, Lithography, Polymers, Polymethylmethacrylate, Chemical analysis, Silicon, Directed self assembly

Proceedings Article | 17 March 2012 Paper
Fumiko Yamashita, Eiichi Nishimura, Koichi Yatsuda, Hiromasa Mochiki, Julie Bannister
Proceedings Volume 8328, 83280T (2012) https://doi.org/10.1117/12.916349
KEYWORDS: Etching, Ions, Picosecond phenomena, Polymethylmethacrylate, Plasma, Chemistry, Dry etching, Polymers, Line edge roughness, Directed self assembly

Proceedings Article | 17 March 2012 Paper
Kazuki Narishige, Takayuki Katsunuma, Masanobu Honda, Koichi Yatsuda
Proceedings Volume 8328, 83280N (2012) https://doi.org/10.1117/12.916340
KEYWORDS: Extreme ultraviolet, Etching, Line width roughness, Photoresist processing, Plasma, Silicon, Electrodes, Photoresist materials, Polymers, Ions

Proceedings Article | 16 March 2012 Paper
Proceedings Volume 8328, 832809 (2012) https://doi.org/10.1117/12.920309
KEYWORDS: Reactive ion etching, Critical dimension metrology, Plasma, Etching, Polymers, Tolerancing, Sulfur, Plasma etching, Carbon monoxide, Image processing

Proceedings Article | 7 March 2008 Paper
Masato Kushibiki, Eiichi Nishimura, Koichi Yatsuda
Proceedings Volume 6924, 692426 (2008) https://doi.org/10.1117/12.772669
KEYWORDS: Reactive ion etching, Critical dimension metrology, Photomasks, Lithography, Double patterning technology, Chemical vapor deposition, Photoresist processing, Etching, Polymers, Fabrication

Proceedings Article | 7 March 2008 Paper
Eiichi Nishimura, Masato Kushibiki, Koichi Yatsuda
Proceedings Volume 6924, 692425 (2008) https://doi.org/10.1117/12.772630
KEYWORDS: Etching, Photomasks, Wet etching, Dry etching, Reactive ion etching, Critical dimension metrology, Silicon, Double patterning technology, Silicon films, Oxides

Showing 5 of 10 publications
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