Commercial introduction of emerging integrated photonics technologies requires a long and complex multi-layer product development, industrialization, and qualification cycles at all levels of value chain from initial product design, material sourcing, component-system-module manufacturing, and testing, through marketing and delivery of new products to the market. Scalable assembly and packaging of electronic-photonic integrated modules is important and may take more than a half of the entire product’s costs. In this paper, we will report on some of our industrial processes for scalable photonics packaging, as well as challenges and results obtained from our research and innovation projects.
Hybrid integrated diode lasers offer a robust and small-sized solution for applications in telecommunications, quantum optics and metrology due to their wide tunability and ultra-narrow linewidth. Here, we present the fabrication, packaging and successful operation of the first fully integrated, aluminum oxide (Al2O3) based, hybrid diode laser operating at 405 nm. Low-loss, high-confinement waveguides are fabricated with a measured propagation loss of only 2.8 ± 0.3 dB/cm. The hybrid laser consists of a GaN SLED butt-coupled to an Al2O3 feedback circuit comprising of two microring resonators that form a frequency selective Vernier filter. The chip assembly is packaged in a hermetically sealed, butterfly housing for optimal performance and durability. The laser shows a maximum output power of 0.74 mW and is tunable over the entire gain bandwidth of 4.4 nm.
We describe the assembly of a 5G transceiver leveraging photonics for the generation, emission and detection of THz wireless signals. The transceiver and all associated control electronics and power supplies are designed for mounting in a mobile aerial unit. A photonics motherboard concept that brings together polymer, III-V and SiNbased photonic platforms and provides optical fiber connectivity is used for the assembly. In addition, scalable integration of 3D components, in this case an antenna rod or rod array, is demonstrated. Thermal considerations arising from the dense integration of photonic and electronic components and the resulting concentrated heat load are also discussed.
Photonic Integrated Circuits (PIC) will change the fundamental paradigms for the design of multi-color laser engines for life sciences. Exemplified with flow cytometry (FCM), integrated optical technology for visible wavelengths will be shown to open a new spectrum of possibilities to control flow cell illumination patterns, such as the number of output spots, the spot size, and even complex patterns generated by interferometry. Integration of additional optical functions such as variable optical attenuation, wavelength division multiplexing or fast shutters adds value to the PIC. TOPTICA is demonstrating integration of PICs in present Multi-color Laser Engine (MLE) architectures. Multiple wavelengths (405nm, 488nm, 561nm, 640nm) are coupled free space into the chip, leveraging its beam steering COOLAC (Constant Optical Output Level Auto Calibration) technology for automatic realignment, thus overcoming the need of fiber input delivery. Once in the waveguide, the light can be redirected and shaped to a desired output pattern and pitch, reducing the need of discrete optical components. In this work, we will discuss the implementation of various building blocks in PIC technology for MLEs and analyze the advantages over current macroscopic counterparts.
Photonic technology is increasingly used in applications in medicine, life and environmental science. Whereas currently many of these applications are implemented using some form of discrete (free-space) optics, much can be gained from a transition to Photonics Integrated Circuits. This follows the trends in the electronics industry where highly integrated electronic circuits have allowed the combination of many different functions in a small form factor. Just as it has done for the electronics industry, integrated optics will lead to smaller, cheaper, more reliable and more user friendly devices.
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