Assembly of mobile 5G transceiver based on photonic motherboard

Bradley W. Snyder; Zerihun G. Tegegne; Nienke Nijenhuis; Tianwen Qian; David de Felipe; Simon Nellen; Milan Deumer; Y. Durvasa Gupta; Moritz Baier; Björn Globisch; Norbert Keil; Joost Van Kerkhof

doi:10.1117/12.2616674

5 March 2022 Assembly of mobile 5G transceiver based on photonic motherboard

Bradley W. Snyder, Zerihun G. Tegegne, Nienke Nijenhuis, Tianwen Qian, David de Felipe, Simon Nellen, Milan Deumer, Y. Durvasa Gupta, Moritz Baier, Björn Globisch, Norbert Keil, Joost Van Kerkhof

Author Affiliations +

Proceedings Volume 12007, Optical Interconnects XXII; 120070K (2022) https://doi.org/10.1117/12.2616674
Event: SPIE OPTO, 2022, San Francisco, California, United States

Abstract

We describe the assembly of a 5G transceiver leveraging photonics for the generation, emission and detection of THz wireless signals. The transceiver and all associated control electronics and power supplies are designed for mounting in a mobile aerial unit. A photonics motherboard concept that brings together polymer, III-V and SiNbased photonic platforms and provides optical fiber connectivity is used for the assembly. In addition, scalable integration of 3D components, in this case an antenna rod or rod array, is demonstrated. Thermal considerations arising from the dense integration of photonic and electronic components and the resulting concentrated heat load are also discussed.

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Bradley W. Snyder, Zerihun G. Tegegne, Nienke Nijenhuis, Tianwen Qian, David de Felipe, Simon Nellen, Milan Deumer, Y. Durvasa Gupta, Moritz Baier, Björn Globisch, Norbert Keil, and Joost Van Kerkhof "Assembly of mobile 5G transceiver based on photonic motherboard", Proc. SPIE 12007, Optical Interconnects XXII, 120070K (5 March 2022); https://doi.org/10.1117/12.2616674

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