Mr. Eungryong Oh Profile

Eungryong Oh

at SK Hynix, Inc.

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Author

Publications (5)

Proceedings Article | 22 February 2021 Presentation + Paper

Qualification of small alignment mark by on-product overlay performance

Jigang Ma, Frans Bijnen, Edo Hulsebos, Lukasz Macht, Sotirios Tsiachris, Jin Dai, Rob van der Meulen, Miao Yu, Paul Böcker, Jung-Hwan Kim, Hyun Kim, Gwang-Gon Kim, Joon-Seuk Lee, Eung-Ryong Oh, Hong-Bok Yeon, Young-Deuk Kim, Seung-Uk Jeong, Sang-Ho Lee, Chan-Ha Park

Proceedings Volume 11613, 116130J (2021) https://doi.org/10.1117/12.2584618

KEYWORDS: Optical alignment, Semiconducting wafers, Overlay metrology, Algorithm development, Semiconductor manufacturing, Scanners, Process control, Device simulation

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Proceedings Article | 27 April 2018 Paper

Spectral tunability for accuracy, robustness, and resilience

Einat Peled, Eran Amit, Yuval Lamhot, Alexander Svizher, Dana Klein, Anat Marchelli, Roie Volkovich, Tal Yaziv, Aaron Cheng, Honggoo Lee, Sangjun Han, Minhyung Hong, Seungyoung Kim, Jieun Lee, Dongyoung Lee, Eungryong Oh, Ahlin Choi, DongSub Choi, DoHwa Lee, Sanghuck Jeon, Jungtae Lee, Seongjae Lee, Zephyr Liu, Jeongpyo Lee, John Robinson

Proceedings Volume 10585, 105850S (2018) https://doi.org/10.1117/12.2300507

KEYWORDS: Metrology, Semiconducting wafers, Laser scattering, Laser metrology, Overlay metrology, Quality measurement, Scatterometry, Apodization, Polarization, Image quality

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In overlay (OVL) metrology the quality of measurements and the resulting reported values depend heavily on the measurement setup used. For example, in scatterometry OVL (SCOL) metrology a specific target may be measured with multiple illumination setups, including several apodization options, two possible laser polarizations, and multiple possible laser wavelengths. Not all possible setups are suitable for the metrology method as different setups can yield significantly different performance in terms of the accuracy and robustness of the reported OVL values. Finding an optimal measurement setup requires great flexibility in measurement, to allow for high-resolution landscape mapping (mapping the dependence of OVL, other metrics, and details of pupil images on measurement setup). This can then be followed by a method for analyzing the landscape and selecting an accurate and robust measurement setup. The selection of an optimal measurement setup is complicated by the sensitivity of metrology to variations in the fabrication process (process variations) such as variations in layer thickness or in the properties of target symmetry. The metrology landscape changes with process variations and maintaining optimal performance might require continuous adjustments of the measurement setup. Here we present a method for the selection and adjustment of an optimal measurement setup. First, the landscape is measured and analyzed to calculate theory-based accurate OVL values as well as quality metrics which depend on details of the pupil image. These OVL values and metrics are then used as an internal ruler (“self-reference”), effectively eliminating the need for an external reference such as CD-SEM. Finally, an optimal measurement setup is selected by choosing a setup which yields the same OVL values as the self-reference and is also robust to small changes in the landscape. We present measurements which show how a SCOL landscape changes within wafer, wafer to wafer, and lot to lot with intentionally designed process variations between. In this case the process variations cause large shifts in the SCOL landscape and it is not possible to find a common optimal measurement setup for all wafers. To deal with such process variations we adjust the measurement setup as needed. Initially an optimal setup is chosen based on the first wafer. For subsequent wafers the process stability is continuously monitored. Once large process variations are detected the landscape information is used for selecting a new measurement setup, thereby maintaining optimal accuracy and robustness. Methods described in this work are enabled by the ATL (Accurate Tunable Laser) scatterometry-based overlay metrology system.

Proceedings Article | 13 March 2018 Paper

Clean focus, dose and CD metrology for CD uniformity improvement

Honggoo Lee , Sangjun Han, Minhyung Hong, Seungyoung Kim, Jieun Lee, DongYoung Lee, Eungryong Oh, Ahlin Choi, Nakyoon Kim, John Robinson, Markus Mengel , Rovira Pablo , Sungchul Yoo, Raphael Getin, Dongsub Choi, Sanghuck Jeon

Proceedings Volume 10585, 105852A (2018) https://doi.org/10.1117/12.2299976

KEYWORDS: Semiconducting wafers, Metrology, Critical dimension metrology, Scanners, Process control, Modulation, Scatterometry, Finite element methods, Signal to noise ratio, Single crystal X-ray diffraction

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Proceedings Article | 13 March 2018 Paper

Accuracy optimization with wavelength tunability in overlay imaging technology

Honggoo Lee, Yoonshik Kang, Sangjoon Han, Kyuchan Shim, Minhyung Hong, Seungyoung Kim, Jieun Lee, Dongyoung Lee, Eungryong Oh, Ahlin Choi, Youngsik Kim, Tal Marciano, Dana Klein, Eitan Hajaj, Sharon Aharon , Guy Ben-Dov , Saltoun Lilach, Dan Serero, Anna Golotsvan

Proceedings Volume 10585, 1058532 (2018) https://doi.org/10.1117/12.2300153

KEYWORDS: Overlay metrology, Semiconducting wafers, Diffraction, Light sources, Imaging technologies, Integrated circuits, Visible radiation, Optical testing, Electromagnetism, Signal processing

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Proceedings Article | 13 March 2018 Presentation + Paper

In-cell overlay metrology by using optical metrology tool

Honggoo Lee , Sangjun Han, Minhyung Hong, Seungyoung Kim, Jieun Lee, DongYoung Lee, Eungryong Oh, Ahlin Choi, Hyowon Park, Waley Liang, DongSub Choi, Nakyoon Kim, Jeongpyo Lee, Stilian Pandev, Sanghuck Jeon, John Robinson

Proceedings Volume 10585, 105851D (2018) https://doi.org/10.1117/12.2300946

KEYWORDS: Semiconducting wafers, Overlay metrology, Model-based design, Metrology, Diffractive optical elements, Etching, Process modeling, Process control, Optical imaging, Optical metrology

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