Dr. Peter Hahmann Profile

Dr. Peter Hahmann

at Vistec Electron Beam Lithography Group

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Author

Publications (8)

Proceedings Article | 3 April 2010 Paper

Monte Carlo modeling of BSE reflection in e-beam writers

H. Alves, K.-P. Johnsen, P. Hahmann, D. Gnieser, C. Frase, H. Bosse

Proceedings Volume 7637, 76371T (2010) https://doi.org/10.1117/12.846517

KEYWORDS: Reflection, Silicon, Teeth, Monte Carlo methods, Semiconducting wafers, Electron beams, Sensors, Objectives, Lithography, Critical dimension metrology

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Proceedings Article | 27 May 2009 Paper

High resolution cell projection

U. Weidenmueller, P. Hahmann, M. Lemke, B. Schnabel, L. Pain, S. Manakli

Proceedings Volume 7470, 74700P (2009) https://doi.org/10.1117/12.835187

KEYWORDS: Vestigial sideband modulation, Electron beam direct write lithography, Electron beam lithography, Beam shaping, Scanning electron microscopy, Standards development, Lithography, Prototyping, Semiconducting wafers, Electron beams

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The ever more demanding requirements in the semiconductor manufacturing sector together with the increasing mask making costs and cycle times call for new lithographic solutions. Electron beam lithography has shown its superior performance and flexibility in advanced patterning applications. It enables already today process and technology developments ahead of the ITRS roadmap, which addresses currently the 32nm and 22nm node or even below. Thus electron beam direct write (EBDW) can avoid the high costs and delay times related to the advanced masks required for critical layers. On the other side EBDW faces the concerns regarding its throughput, which bases upon the inherited sequential exposure method. A solution to improve the throughput performance offers the implementation of the cell projection method as already materialized in the Vistec SB3055 tool. In addition to the variable shape beam technology, which can project regular structures (rectangles, slants and triangles) only, cell projection is able to image complex structures. Thus, structures that would have required a multiple of regular shots are now projected in one single shot. Thanks to this approach not only the shot count is noticeably reduced, but also the overall throughput is increased. First experimental and simulation results show an improvement of a factor of about 3X. Nevertheless, the final throughput gain strongly depends on the pattern and data structure itself. Combining high resolution variable shape beam technology with the cell projection feature allows advanced R&D and small volume and prototyping applications to be performed with one system. The Vistec SB3055 features the high resolution capability of variable shape beam lithography and incorporates the advantages of the cell projection technology. Owing to this new option we are able to improve the throughput for standard design features while maintaining the required high accuracy of our exposure system. Beside this, the combination of cell projection and standard shape beam technology still offers a high degree of flexibility as the key advantage of EBDW. On the Vistec SB3055 system we have performed different resolution tests serving as comparison between cell projection and standard shape beam. In this paper we will present the resolution capability obtained with cell projection on test structures as well as the general accuracy achieved for real patterns.

Proceedings Article | 18 March 2009 Paper

Optimization of BSE-detector for e-beam direct write lithography

H. Alves, P. Hahmann, M. Slodowski, C. Frase, D. Gnieser, Klaus-Peter Johnsen, H. Bosse

Proceedings Volume 7271, 72712O (2009) https://doi.org/10.1117/12.814156

KEYWORDS: Sensors, Signal to noise ratio, Monte Carlo methods, Signal detection, Lithography, Etching, Scattering, Electron beams, Direct write lithography, Vestigial sideband modulation

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Proceedings Article | 26 March 2008 Paper

E-beam direct write alignment strategies for the next generation node

H. Alves, P. Hahmann, K.-H. Kliem, U. Weidenmueller, S. Jahr, C. Frase, D. Gnieser, H. Bosse, R. Zimmermann, C. Arndt

Proceedings Volume 6921, 69210I (2008) https://doi.org/10.1117/12.771585

KEYWORDS: Optical alignment, Monte Carlo methods, Sensors, Silicon, Signal to noise ratio, Signal detection, Semiconducting wafers, Vestigial sideband modulation, Electron beam direct write lithography, Lithography

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Proceedings Article | 3 May 2007 Paper

Electron beam direct write: shaped beam overcomes resolution concerns

Ines Stolberg, Laurent Pain, Johannes Kretz, Monika Boettcher, Hans-Joachim Doering, Juergen Gramss, Peter Hahmann

Proceedings Volume 6533, 65330J (2007) https://doi.org/10.1117/12.736974

KEYWORDS: Electron beam direct write lithography, Electron beams, Vestigial sideband modulation, Semiconductors, Prototyping, Manufacturing, Photomasks, Beam shaping, Electron beam lithography, Lithography

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Proceedings Article | 16 June 2003 Paper

Mix and match capability of e-beam direct-write for the 65-nm technology

Yves Laplanche, Murielle Charpin, Laurent Pain, J. Todeschini, Daniel Henry, Pierre-Olivier Sassoulas, S. Gough, Ulf Weidenmueller, Peter Hahmann

Proceedings Volume 5037, (2003) https://doi.org/10.1117/12.482342

KEYWORDS: Semiconducting wafers, Scanners, Optical alignment, Electron beam direct write lithography, Distortion, Overlay metrology, Electron beam lithography, Photomasks, Optical lithography, Error analysis

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Proceedings Article | 21 July 2000 Paper

Evaluation of fine pattern definition with electron-beam direct writing lithography

Tsann-Bim Chiou, Peter Hahmann, Ming-Chi Liaw, Tiao-Yuan Huang, Simon Sze

Proceedings Volume 3997, (2000) https://doi.org/10.1117/12.390104

KEYWORDS: Critical dimension metrology, Edge roughness, Beam shaping, Electron beam lithography, Scattering, Lithography, Laser scattering, Control systems, Electron beam direct write lithography, Double patterning technology

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Proceedings Article | 3 July 1995 Paper

ZBA31: an advanced mask writer meeting the demands of the 1-gigabit DRAM generation

Christian Ehrlich, Olaf Fortagne, Peter Hahmann

Proceedings Volume 2512, (1995) https://doi.org/10.1117/12.212769

KEYWORDS: Beam shaping, Vestigial sideband modulation, Photomasks, Software development, Edge roughness, Image quality, Motion measurement, Control systems, Electron beams, Interferometers

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Showing 5 of 8 publications

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