Michael Collins
at MIT Lincoln Lab
SPIE Involvement:
Author
Publications (4)

Proceedings Article | 9 March 2023 Presentation
Proceedings Volume PC12447, PC1244727 (2023) https://doi.org/10.1117/12.2657368

Proceedings Article | 30 May 2022 Presentation + Paper
Proceedings Volume 12089, 120890C (2022) https://doi.org/10.1117/12.2618610
KEYWORDS: Semiconducting wafers, Silicon, Readout integrated circuits, Wafer bonding, Sensors, Avalanche photodiodes, Single photon detectors, LIDAR

Proceedings Article | 30 May 2022 Presentation + Paper
Brian Aull, Michael Collins, Kevan Donlan, Joseph Ciampi, Meera Punjiya, K. Alexander McIntosh, Kevin Ryu, Deborah Woods
Proceedings Volume 12089, 120890E (2022) https://doi.org/10.1117/12.2618169
KEYWORDS: Semiconducting wafers, Capacitance, Avalanche photodiodes, Sensors, Silicon, LIDAR, Zemax, Readout integrated circuits, Ray tracing, Data modeling

Proceedings Article | 13 December 2020 Presentation + Paper
C. Leitz, K. Donlon, D. Young, R. Lambert, M. Collins, B. Burke, M. Zhu, S. Rabe, M. Cooper, D. O'Mara
Proceedings Volume 11454, 114541B (2020) https://doi.org/10.1117/12.2562583
KEYWORDS: Charge-coupled devices, Semiconducting wafers, Germanium, Back end of line, Silicon, Atomic layer deposition, Sensors, Reticles, Hard x-rays, Back illuminated sensors

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