Systems for imaging require to employ high quality optical components in order to dispose of optical aberrations and thus reach sufficient resolution. However, well-known methods to get rid of optical aberrations, such as aspherical profiles or diffractive corrections are not easy to apply to micro-optics. In particular, some of these methods rely on polymers which cannot be associated when such lenses are to be used in integrated devices requiring high temperature process for their further assembly and separation. Among the different approaches, the most common is the lens splitting that consists in dividing the focusing power between two or more optical components. In here, we propose to take advantage of a wafer-level technique, devoted to the generation of glass lenses, which involves thermal reflow in silicon cavities to generate lens doublets. After the convex lens sides are generated, grinding and polishing of both stack sides allow, on the first hand, to form the planar lens backside and, on the other hand, to open the silicon cavity. Nevertheless, silicon frames are then kept and thinned down to form well-controlled and auto-aligned spacers between the lenses. Subsequent accurate vertical assembly of the glass lens arrays is performed by anodic bonding. The latter ensures a high level of alignment both laterally and axially since no additional material is required. Thanks to polishing, the generated lens doublets are then as thin as several hundreds of microns and compatible with micro-opto-electro-systems (MOEMS) technologies since they are only made of glass and silicon. The generated optical module is then robust and provide improved optical performances. Indeed, theoretically, two stacked lenses with similar features and spherical profiles can be almost diffraction limited whereas a single lens characterized by the same numerical aperture than the doublet presents five times higher wavefront error. To demonstrate such assumption, we fabricated glass lens doublets and compared them to single lenses of equivalent focusing power. For similar illumination, the optical aberrations are significantly reduced.
In this work, vertical integration of miniaturized array-type Mirau interferometers at wafer level by using multi-stack anodic bonding is presented. Mirau interferometer is suitable for MEMS metrology and for medical imaging according to its vertical-, lateral- resolutions and working distances. Miniaturized Mirau interferometer can be a promising candidate as a key component of an optical coherence tomography (OCT) system. The miniaturized array-type interferometer consists of a microlens doublet, a Si-based MEMS Z scanner, a spacer for focus-adjustment and a beam splitter. Therefore, bonding technologies which are suitable for heterogeneous substrates are of high interest and necessary for the integration of MEMS/MOEMS devices. Multi-stack anodic bonding, which meets the optical and mechanical requirements of the MOEMS device, is adopted to integrate the array-type interferometers. First, the spacer and the beam splitter are bonded, followed by bonding of the MEMS Z scanner. In the meanwhile, two microlenses, which are composed of Si and glass wafers, are anodically bonded to form a microlens doublet. Then, the microlens doublet is aligned and bonded with the scanner/spacer/beam splitter stack. The bonded array-type interferometer is a 7- wafer stack and the thickness is approximately 5mm. To separate such a thick wafer stack with various substrates, 2-step laser cutting is used to dice the bonded stack into Mirau chips. To simplify fabrication process of each component, electrical connections are created at the last step by mounting a Mirau chip onto a flip chip PCB instead of through wafer vias. Stability of Au/Ti films on the MEMS Z scanner after anodic bonding, laser cutting and flip chip bonding are discussed as well.
In this paper, we present construction, fabrication and characterization of an electrostatic MOEMS vertical microscanner for generation of an optical phase shift in array-type interferometric microsystems. The microscanner employs asymmetric comb-drives for a vertical displacement of a large 4x4 array of reference micromirrors and for in-situ position sensing. The device is designed to be fully compatible with Mirau configuration and with vertical integration strategy. This enables further integration of the device within an "active" multi-channel Mirau micro-interferometer and implementation of the phase shifting interferometry (PSI) technique for imaging applications. The combination of micro-interferometer and PSI is particularly interesting in the swept-source optical coherence tomography, since it allows not only strong size reduction of a system but also improvement of its performance (sensitivity, removal of the image artefacts). The technology of device is based on double-side DRIE of SOI wafer and vapor HF releasing of the suspended platform. In the static mode, the device provides vertical displacement of micromirrors up to 2.8μm (0 - 40V), whereas at resonance (fo=500 Hz), it reaches 0.7 μm for only 1VDC+1VAC. In both operation modes, the measured displacement is much more than required for PSI implementation (352nm peak-to-peak). The presented device is a key component of array-type Mirau micro-interferometer that enables the construction of portable, low-cost interferometric systems, e.g. for in vivo medical diagnostics.
Some of the critical limitations for widespread use in medical applications of optical devices, such as confocal or optical coherence tomography (OCT) systems, are related to their cost and large size. Indeed, although quite efficient systems are available on the market, e.g. in dermatology, they equip only a few hospitals and hence, are far from being used as an early detection tool, for instance in screening of patients for early detection of cancers. In this framework, the VIAMOS project aims at proposing a concept of miniaturized, batch-fabricated and lower-cost, OCT system dedicated to non-invasive skin inspection. In order to image a large skin area, the system is based on a full-field approach. Moreover, since it relies on micro-fabricated devices whose fields of view are limited, 16 small interferometers are arranged in a dense array to perform multi-channel simultaneous imaging. Gaps between each channel are then filled by scanning of the system followed by stitching. This approach allows imaging a large area without the need of large optics. It also avoids the use of very fast and often expensive laser sources, since instead of a single point detector, almost 250 thousands pixels are used simultaneously. The architecture is then based on an array of Mirau interferometers which are interesting for their vertical arrangement compatible with vertical assembly at the wafer-level. Each array is consequently a local part of a stack of seven wafers. This stack includes a glass lens doublet, an out-of-plane actuated micro-mirror for phase shifting, a spacer and a planar beam-splitter. Consequently, different materials, such as silicon and glass, are bonded together and well-aligned thanks to lithographic-based fabrication processes.
The paper presents the multi-wafer bonding technology as well as the integration of electrical connection to the zscanner
wafer of the micromachined array-type Mirau interferometer. A Mirau interferometer, which is a key-component
of optical coherence tomography (OCT) microsystem, consists of a microlens doublet, a MOEMS Z-scanner, a focusadjustment
spacer and a beam splitter plate.
For the integration of this MOEMS device heterogeneous bonding of Si, glass and SOI wafers is necessary. Previously,
most of the existing methods for multilayer wafer bonding require annealing at high temperature, i.e., 1100°C. To be
compatible with MEMS devices, bonding of different material stacks at temperatures lower than 400°C has also been
investigated. However, if more components are involved, it becomes less effective due to the alignment accuracy or
degradation of surface quality of the not-bonded side after each bonding operation.
The proposed technology focuses on 3D integration of heterogeneous building blocks, where the assembly process is
compatible with the materials of each wafer stack and with position accuracy which fits optical requirement. A
demonstrator with up to 5 wafers bonded lower than 400°C is presented and bond interfaces are evaluated.
To avoid the complexity of through wafer vias, a design which creates electrical connections along vertical direction by
mounting a wafer stack on a flip chip PCB is proposed. The approach, which adopts vertically-stacked wafers along with
electrical connection functionality, provides not only a space-effective integration of MOEMS device but also a design
where the Mirau stack can be further integrated with other components of the OCT microsystem easily.
The presented paper shows the concept and optical design of an array-type Mirau-based OCT system for early diagnosis of skin cancer. The basic concept of the sensor is a full-field, full-range optical coherence tomography (OCT) sensor. The micro-optical interferometer array in Mirau configuration is a key element of the system allowing parallel imaging of multiple field of views (FOV). The optical design focuses on the imaging performance of a single channel of the interferometer array and the illumination design of the array. In addition a straylight analysis of this array sensor is given.
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