Soft imprint templates trend to deformation when imprint forces are added. This deformation occurs both in the macro
aspect (unevenness of the imprint resist layer through the whole imprint area) and in the micro aspect (deformation of
single structure). These deformations will be transferred directly to the imprint resist after its curing and thus influence
the imprint results. An understanding of these deformation behaviors depending on the template geometry and the
imprint process parameters is necessary for the process development. In this work the deformation behaviors of the
polymer soft imprint template was analyzed using finite element method (FEM) and experimentally investigated.
We developed Fluor-based RIE processes to fabricate nanoimprint template in silicon and to transfer patterns from the
imprint resist to the silicon substrate. The etched silicon patterns have slightly tapered and smooth sidewalls. The
sidewall angle can be controlled between 85° and 90° by varying the ratio of the used gas. The dimension of the etched
structures is identical with the patterns in the resist. We demonstrated line structures in silicon substrate down to 50 nm.
The etching rate is over 100 nm per minute and the maximal achieved aspect ratio is more than 10.
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