Paper
20 March 2006 Immersion specific defect mechanisms: findings and recommendations for their control
Author Affiliations +
Abstract
Defectivity has been one of the largest unknowns in immersion lithography. It is critical to understand if there are any immersion specific defect modes, and if so, what their underlying mechanisms are. Through this understanding, any identified defect modes can be reduced or eliminated to help advance immersion lithography to high yield manufacturing. Since February 2005, an ASML XT:1250Di immersion scanner has been operational at IMEC. A joint program was established to understand immersion defectivity by bringing together expertise from IMEC, ASML, resist vendors, IC manufactures, TEL, and KLA-Tencor. This paper will cover the results from these efforts. The new immersion specific defect modes that will be discussed are air bubbles in the immersion fluid, water marks, wafer edge film peeling, and particle transport. As part of the effort to understand the parameters that drive these defects, IMEC has also developed novel techniques for characterizing resist leaching and water uptake. The findings of our investigations into each immersion specific defect mechanism and their influencing factors will be given in this paper, and an attempt will be made to provide recommendations for a process space to operate in to limit these defects.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael Kocsis, Dieter Van Den Heuvel, Roel Gronheid, Mireille Maenhoudt, Dizana Vangoidsenhoven, Greg Wells, Nickolay Stepanenko, Michael Benndorf, Hyun Woo Kim, Shinji Kishimura, Monique Ercken, Frieda Van Roey, S. O'Brien, Wim Fyen, Philippe Foubert, Richard Moerman, and Bob Streefkerk "Immersion specific defect mechanisms: findings and recommendations for their control", Proc. SPIE 6154, Optical Microlithography XIX, 615409 (20 March 2006); https://doi.org/10.1117/12.660432
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CITATIONS
Cited by 15 scholarly publications.
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KEYWORDS
Semiconducting wafers

Thin film coatings

Water

Particles

Scanners

Immersion lithography

Manufacturing

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