Micro channel cooled single emitter housing

J. Wiesend; F. Wagle; S. Lutter

doi:10.1117/12.3000061

12 March 2024 Micro channel cooled single emitter housing

J. Wiesend, F. Wagle, S. Lutter

Proceedings Volume 12866, Components and Packaging for Laser Systems X; 128660F (2024) https://doi.org/10.1117/12.3000061
Event: SPIE LASE, 2024, San Francisco, California, United States

Abstract

Rogers Micro-Channel Coolers (MCC) cover a wide range of thermal management applications, such as laser diode heat sinks and CPU coolers. Apart from top-of-the-line thermal performance, some applications require a particularly homogeneous temperature distribution. In this paper, we present Finite-Element-Method (FEM) simulation results of a new MCC stack setup for single emitter laser diodes and a solid copper heatsink reference with variable heat transfer coefficient (α) on the bottom side. Characteristic curves for temperature (T), temperature difference (ΔT) between optical components and pressure drop are shown as a function of α and flow rate. We find a ΔT of less than 2 K between the semiconductor elements and a total T reduction of ⪆20 K compared to the reference heatsink.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

J. Wiesend, F. Wagle, and S. Lutter "Micro channel cooled single emitter housing", Proc. SPIE 12866, Components and Packaging for Laser Systems X, 128660F (12 March 2024); https://doi.org/10.1117/12.3000061

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