The simulation design of composite heat sink of 830nm energy-supplying laser

Gangjie Lou; Can Li; Li Xia

doi:10.1117/12.3004412

24 November 2023 The simulation design of composite heat sink of 830nm energy-supplying laser

Gangjie Lou, Can Li, Li Xia

Proceedings Volume 12935, Fourteenth International Conference on Information Optics and Photonics (CIOP 2023); 129350U (2023) https://doi.org/10.1117/12.3004412
Event: Fourteenth International Conference on Information Optics and Photonics (CIOP 2023), 2023, Xi’an, China

Abstract

In order to reduce the active region temperature of single core semiconductor lasers and improve the reliability of packaging devices, based on the COS packaging form, this work conducted heat dissipation analysis on the established "sandwich" structure and composite stacked structure semiconductor laser models. The flip chip packaging structure was optimized, Graphene film was used to increase the transverse heat dissipation channel of semiconductor laser, and the longitudinal heat conduction was carried out in combination with the heat dissipation copper sheet. Finally, the structural model of Graphene composite heat sink was established using SolidWorks software. By using ANSYS finite element software for steady-state thermal analysis comparison, the goal of reducing the temperature and thermal stress in the active region of semiconductor lasers was achieved. The proposed composite heat sink model can provide a design idea and method for high reliability laser packaging structures.

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Gangjie Lou, Can Li, and Li Xia "The simulation design of composite heat sink of 830nm energy-supplying laser", Proc. SPIE 12935, Fourteenth International Conference on Information Optics and Photonics (CIOP 2023), 129350U (24 November 2023); https://doi.org/10.1117/12.3004412

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