Microtechnology management considering test and cost aspects for stacked 3D ICs with MEMS

K. Hahn; M. Wahl; R. Busch; A. Grünewald; R. Brück

doi:10.1117/12.2282355

2 January 2018 Microtechnology management considering test and cost aspects for stacked 3D ICs with MEMS

K. Hahn, M. Wahl, R. Busch, A. Grünewald, R. Brück

Proceedings Volume 10456, Nanophotonics Australasia 2017; 1045653 (2018) https://doi.org/10.1117/12.2282355
Event: SPIE Nanophotonics Australasia, 2017, Melbourne, Australia

Abstract

Innovative automotive systems require complex semiconductor devices currently only available in consumer grade quality. The European project TRACE will develop and demonstrate methods, processes, and tools to facilitate usage of Consumer Electronics (CE) components to be deployable more rapidly in the life-critical automotive domain. Consumer electronics increasingly use heterogeneous system integration methods and "More than Moore" technologies, which are capable to combine different circuit domains (Analog, Digital, RF, MEMS) and which are integrated within SiP or 3D stacks. Making these technologies or at least some of the process steps available under automotive electronics requirements is an important goal to keep pace with the growing demand for information processing within cars. The approach presented in this paper aims at a technology management and recommendation system that covers technology data, functional and non-functional constraints, and application scenarios, and that will comprehend test planning and cost consideration capabilities.

Citation Download Citation

K. Hahn, M. Wahl, R. Busch, A. Grünewald, and R. Brück "Microtechnology management considering test and cost aspects for stacked 3D ICs with MEMS", Proc. SPIE 10456, Nanophotonics Australasia 2017, 1045653 (2 January 2018); https://doi.org/10.1117/12.2282355

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