ASELSAN has made significant progress on developing its short-wave infrared (SWIR) technology, with a focus on improving dark current, quantum efficiency, and operability. In recent work, shunt current and generation-recombination current have been identified as the predominant dark current mechanisms. Shunt current can be suppressed by reducing the dangling bond count which requires optimizing the focal plane array passivation, and generation-recombination current can be reduced by improving the device design. Extensive work on process optimization employing various passivation schemes combined with theoretical layer design has lowered the SWIR focal plane array pixel dark current values down to < 1 nA/cm2. Furthermore, achieving low dark current without sacrificing high quantum efficiency (exceeding 80%), by building on the previous process and post-process work, has enhanced the sensor’s ability to capture faint signals. 640x512 format and 15 μm pitch SWIR focal plane arrays coupled with ASEL64015CG read-out circuits have consistently reached > 99.9% operability. After maturing the development work, ASELSAN launches its SWIR detector, LEOP-640/15-SW, pioneering the company’s photodetector production. In this paper, the results of the theoretical and experimental R and D work on LEOP photodetector development and production at ASELSAN are presented.
ASELSAN, the largest defense company in Türkiye, develops high performance electro-optical systems for various applications. Research and development activities have been carried out on developing HgCdTe (MCT) detectors for long-wavelength infrared (LWIR) and mid-wavelength infrared (MWIR). In this paper, recent results for VGA 15μm pitch MWIR MCT detectors at IDDCA level are presented. P-on-n MCT epilayers are used for FPA fabrication with either mesa or planar pixel structures. Typically, over 99% operability and less than 20mK NETD values are achieved for 15μm pitch 640x512 format MWIR MCT FPAs at IDDCA level (F/4) in a repeatable fashion. Thermal cycle, mechanical shock, vibration and environmental tests (such as storage and operation under hot and cold temperatures) were applied to these MWIR MCT IDDCAs and passed successfully. Besides ongoing efforts on development of FPAs with 15μm pixel pitch, development activities for pixel pitch reduction also initiated recently for MWIR MCT and very promising results are achieved.
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