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Dr. Stefan Holzer
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Publications (1)
Proceedings Article | 30 June 2005 Paper
Transient electro-thermal investigations of interconnect structures exposed to mechanical stress
Stefan Holzer, Christian Hollauer, Hajdin Ceric, Stephan Wagner, Erasmus Langer, Tibor Grasser, Siegfried Selberherr
Proceedings Volume 5837, (2005) https://doi.org/10.1117/12.608414
KEYWORDS: Copper, Metals, Silicon, 3D modeling, Microelectronics, Thermal modeling, Computer simulations, Ions, Chemical species, Temperature metrology
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