CONFERENCE PROCEEDINGS
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Prof. Moo Whan Shin
at Myongji Univ
SPIE Involvement:
Author
Publications (4)
Proceedings Article | 28 September 2006 Paper
Thermal effects of moisture inducing delamination in light-emitting diode packages
Jianzheng Hu, Lianqiao Yang, Moo Whan Shin
Proceedings Volume 6355, 635516 (2006) https://doi.org/10.1117/12.691555
KEYWORDS: Light emitting diodes, Lead, Resistance, Diffusion, Epoxies, Thermal effects, Finite element methods, Temperature metrology, Packaging, Interfaces
Proceedings Article | 21 September 2006 Paper
Thermal design of high-power LED package and system
Proceedings Volume 6355, 635509 (2006) https://doi.org/10.1117/12.690928
KEYWORDS: Light emitting diodes, Resistance, Temperature metrology, Thermal effects, Convection, Ceramics, Silver, Packaging, Liquids, Epoxies
Proceedings Article | 21 September 2006 Paper
Thermal analysis of multichip LED packages
Lan Kim, Jonghwa Choi, Sunho Jang, Moo Whan Shin
Proceedings Volume 6355, 63550E (2006) https://doi.org/10.1117/12.691560
KEYWORDS: Light emitting diodes, Resistance, Temperature metrology, Thermal analysis, Calibration, Sensors, Gallium nitride, LED lighting, Packaging, Superposition
Proceedings Article | 12 September 2006 Paper
Thermal analysis and design of high-power LED packages and systems
Lan Kim, Moo Whan Shin
Proceedings Volume 6337, 63370U (2006) https://doi.org/10.1117/12.687681
KEYWORDS: Light emitting diodes, Resistance, Thermography, Packaging, Temperature metrology, Thermal analysis, Calibration, Sensors, Thermal effects, Local area networks
Conference Committee Involvement (1)
Advanced LED for Solid-State Lighting (Special Symposium)
5 September 2006 | Gwangju, South Korea
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