As the system integration of electronic equipment in the cabin becomes increasingly complex, the application of blind insertion structures is becoming increasingly widespread. At the same time, the system has strict requirements for weight indicators. Traditional design is becoming increasingly difficult to meet requirements. This article designs a device suitable for blind insertion and assembly of multiple module units, which abandons conventional chassis frames or pullers. Through the guide plate and the connector guide pins of each module, the horizontal and vertical directions are respectively guided and positioned. The device is designed with a load-bearing device structure and a top pulling device structure, allowing each module unit to be individually plugged in and out, making it easy to install, debug, and disassemble. An integrated assembly and integration plan has been established, which achieves the assembly and integration of electronic devices through the design of blind insertion and assembly devices. This device effectively solves the main contradiction of multiple blind insertion points in the structure, high insertion force, and high assembly accuracy requirements.
With the continuous improvement of the functional performance demand of complex electronic equipment, the electronics on board are becoming more and more integrated. Traditional structure designs are becoming increasingly difficult to meet the requirements with harsh weight index. In this paper, a lightweight space-borne electronic device with blind insertion structure is designed. The conventional chassis frame structure is abandoned. By connecting to the backplane through blind connectors, the type and number of cable connections inside the electronic equipment are greatly reduced. It solves the main contradiction of equipment volume, weight and heat dissipation. The mechanical characteristics and thermal analysis of electronic equipment structure are carried out by finite element method. The corresponding structural deformation and stress distributions are obtained. The results show that, the electronic equipment meets the requirements of structural stiffness and thermal design. The structural design is reliable and safe.
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