Silicon photonics is now considered the photonics platform of choice for short-reach data center single mode pluggable transceivers. With the emergence of co-packaged optics concepts, it can also enable high performance computing with power-efficient interconnect, but also Lidar system integration or even optical quantum computing. In this paper we will present an overview of what can be achieved in state-of-the-art silicon photonics platforms and we will discuss some of the emerging technology trends. In particular, we will discuss the integration of LPCVD SiN in an active silicon photonics platform.
Space stringent requirements in one hand and huge demand for the high performance, low cost modules on the other hand push the Space technologies toward more compact and integrated solutions. This is a trend inherited from Electronic world being transformed from a transistor level boards to more advance and functionalized ICs with million components integrated inside. Photonic Integrated Circuit (PIC) based optical devices are dominating the terrestrial domain in medical facilities, datacenters and civil infrastructures. There is no doubt, in order to reduce the AIT cost and increase the performance PICs are the recommended solution for the future needs including Space Market. There are obvious advantages to use PICs instead of discrete components which could be categorized in three levels: performance, SWaP and cost. With respect to the performance, integration potentially means lower coupling loss between components. For microwave photonic application, any optical loss in dB is translated to 2 dB loss in the electrical signal. Reduced size and weight is the distinct advantage of the integration where multiple optical channels and components are designed and manufactured in small form factor with potentially improved power consumption. This reduces the packaging, qualification and assembly costs.
In this presentation we will report on our recent work on new materials that can be monolithically integrated on high-index contrast silicon or silicon nitride photonic ICs to enhance their functionality. This includes graphene and other 2D-materials for realizing compact electro-absorption modulators and non-linear devices, ferroelectric materials for realizing phase modulators and adiabatic couplers for realizing bistable switches.
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