We report on advances in the fabrication of Josephson junctions, crucial devices in superconducting quantum circuits. In our previous work, we successfully fabricated these on 12-inch substrates using ArF immersion lithography. To enable future large-scale production, we are moving towards sputtering and dry etching techniques. After initial successful tests on a 4-inch substrate, we have now verified this process on 12-inch substrate fabrication equipment, marking significant progress despite the challenges we have faced.
In recent years, the number of qubits in superconducting quantum computers has increased. It is anticipated that future attempts to realize fault-tolerant superconducting quantum computers will require an ability to fabricate large numbers of superconducting qubits uniformly on large-area substrates. Specifically, it is expected that technology will be developed to fabricate a large number of Josephson junctions on a 12-inch substrate in a short period with minimum dimensional variations in the superconducting quantum circuits. In this manuscript, we report on a technology that enables the uniform formation of resist patterns for Josephson junctions in large quantities on 12-inch substrates by replacing electron beam lithography with ArF immersion lithography.
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