Sapphire single crystal is widely used in weapons, aerospace and other fields because of its high hardness, high temperature resistance and excellent optical properties. The surface topography of sapphire grinding has an important influence on its subsequent processing and service performance. Aiming at giving consideration to machining efficiency and surface quality, this paper puts forward a high-efficiency ultra precision machining scheme of sapphire by using ultra precision five axis machining center machine tool and diamond grinding wheels with different particle sizes to realize efficient removal of crystal materials and obtain high machining surface quality. Through experiments, the effects of different grinding process parameters on machined surface roughness and material removal rate are studied. The surface roughness and surface morphology of sapphire ground by diamond grinding wheel are detected by metallographic microscope and touched optical measuring instrument. The test results show that the feed speed of grinding wheel has the greatest influence on the surface quality and roughness and material remove rate, the rotation speed of grinding wheel takes the second place, and the rotation speed of substrate has little influence; Reducing the grinding particle diameter of grinding wheel is helpful to improve the machined surface quality.
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