Single-crystal alumina (sapphire) and transparent polycrystalline alumina are compelling candidates for laser processing in optical applications. In this study, single-shot laser irradiations (~10^15 W/cm2) on sapphire and polycrystalline alumina are investigated. A laser in the femtosecond regime (1030 nm, 490 fs) is used to examine the mechanisms of laser-induced damage on sapphire and polycrystalline alumina. The damage morphologies are characterized using a Scanning Electron Microscope (SEM), Atomic Force Microscopy (AFM), and optical profilometer. When irradiated with a single-shot ultrafast laser pulse, sapphire and polycrystalline alumina show dissimilar damage mechanisms, attributed mainly to the difference in the microstructure. In addition, a quantitative analysis of crater diameter, depth, and volume is conducted. The laser-induced damage thresholds of the materials are determined. The quantitative analysis provides insight into the scaling relationship between the laser parameters and damage morphologies for sapphire and polycrystal alumina.
This research looks to enhance our understanding of the laser-material interaction within silicon, considering variations in free carrier density. Silicon exhibits distinct optical behaviors, ranging from transparency to non-transparency, contingent on its doping concentration, particularly at a 1064 nm wavelength. Our experimental investigation delves into the quantitative assessment of damage size and the qualitative characterization of damage morphology induced by singlepulse 1064 nm laser irradiation. In this experiment, we vary laser intensities and focal depths to show their influence on the damage features of single crystal silicon with varying doping concentrations. The damage size and qualitative characteristics can be used to better understand the mechanisms responsible for the laser damage. Additionally, we can see when the damaged silicon is exhibiting pure melting or a form of ordered damage at higher intensities. The findings of this study give insight into the optimization of laser processing techniques that require precise control over material ablation, and phase change as cutting and material joining. Furthermore, the insights garnered from this work contribute to a broader understanding of the interplay between laser parameters and material properties. This study represents a move towards unlocking the potential of laser-matter interactions in shaping the future of silicon advanced manufacturing technologies.
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