As 5/6G technologies are constantly evolving, radio links must be easily designed and analyzed. Focusing on budget and spur analyses for frequency domain concurrently with time domain simulation, the present paper presents a complete and new evaluation approach for radio frequency (RF) links in conformance with matching at the ports of the RF components blocks. Frequency and time domain simulations of RF links allow shorter design time and higher performances in a what-if approach. In the system simulation of the proposed radio link, the signal heritage stipulates if a signal corresponds to the carrier or is a source of intermodulation or distortion produced in the link considering the compression point and leakage from output to the input of power in various points through the link.
For high data-rates specific rules must be applied to properly model interconnects and their behavior in both time and frequency domains. Each domain allows different types of analysis that can easily highlight different aspects that appears when multilayer printed circuit boards (PCB) traces are represented through transmission lines in microstrip or stripline technologies. An implementation of wideband Debye model is proposed as a solution to rigorously design high-speed interconnections. The paper presents the model and, for easily understanding of the algorithm, the steps to be implemented in any electromagnetic simulation software that has default invariant electrical parameters as dielectric constant or loss tangent. This has a great impact on the overall signal integrity analyses and results are presented for various traces lengths through the insertion and return loss or associated group delay. Although roughness models should be considered at high data rates in this paper only the dielectric loss will be implemented, as influence of the dielectric loss is greater comparing to the conductive loss.
Current high-speed circuit designs with signal rates up to 100Gbps and above are implying constraints for dielectric and conductive materials and their dependence of frequency, for component elements and for production processes. The purpose of this paper is to highlight through various simulation results the frequency dependence of specific parameters like insertion and return loss, eye diagrams, group delay that are part of signal integrity analyses type. In low-power environment designs become more complex as the operation frequency increases. The need for new materials with spatial uniformity for dielectric constant is a need for higher data rates circuits. The fiber weave effect (FWE) will be analyzed through the eye diagram results for various dielectric materials in a differential signaling scheme given the fact that the FWE is a phenomenon that affects randomly the performance of the circuit on balanced/differential transmission lines which are typically characterized through the above mentioned approaches. Crosstalk between traces is also of concern due to propagated signals that have tight rise and fall times or due to high density of the boards. Criteria should be considered to achieve maximum performance of the designed system requiring critical electronic properties.
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