Dr. Changsheng Ying Profile

Dr. Changsheng Ying

Engineer at TSMC

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 31 March 2014 Paper

Pattern-based full-chip process verification

Changsheng Ying, Yongjun Kwon, Paul Fornari, Gökhan Perçin, Anwei Liu

Proceedings Volume 9052, 905212 (2014) https://doi.org/10.1117/12.2046045

KEYWORDS: Optical proximity correction, Databases, Image classification, Lithography, Data modeling, Image processing, Semiconductor manufacturing, Optical lithography, Instrument modeling, Logic devices

Read Abstract +

This paper discusses a novel pattern based standalone process verification technique that meets with current and future needs for semiconductor manufacturing of memory and logic devices. The choosing the right process verification technique is essential to bridge the discrepancy between the intended and the printed pattern. As the industry moving to very low k1 patterning solutions at each technology node, the challenges for process verification are becoming nightmare for lithography engineers, such as large number of possible verification defects and defect disposition. In low k1 lithography, demand for full-chip process verification is increasing. Full-chip process verification is applied post to process and optical proximity correction (OPC) step. The current challenges in process verification are large number of defects reported, disposition difficulties, long defect review times, and no feedback provided to OPC. The technique presented here is based on pattern based verification where each reported defects are classified in terms of patterns and these patterns are saved to a database. Later this database is used for screening incoming new design prior to OPC step.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years