Dr. ByeongSoo Lee Profile

Dr. ByeongSoo Lee

at SAMSUNG Electronics Co Ltd

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Author

Publications (5)

Proceedings Article | 24 March 2017 Paper

Reticle heating feed-forward control (RHC2) on NXT:1980Di immersion scanner for enhanced on-product overlay

Young Ha Kim, Jonghoon Jang, Byeong Soo Lee, Hyunwoo Hwang, Youngsun Nam, Jeong-Heung Kong, Young Seog Kang, Se-Yeon Jang, Bart Paarhuis, Jeroen van der Wielen, Barry Moest, Joris Jongen, Stefan Weichselbaum, Niek Verbeek, Marco Stavenga, Roelof de Graaf, Richard Droste

Proceedings Volume 10147, 1014717 (2017) https://doi.org/10.1117/12.2259792

KEYWORDS: Reticles, Scanners, Distortion, HVAC controls, Optical alignment, Control systems, Thermal effects, Temperature metrology, Semiconducting wafers, Overlay metrology, Calibration

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Scanners in High-Volume-Manufacturing conditions will experience a large range of reticles that vary in reticle transmission and reticle diffraction characteristics. Especially under full production loads reticles will heat up due to the exposure light-load and as such experience thermo-mechanical deformations. The resulting reticle pattern distortion can be partially translated in a deteriorated overall system overlay. Due to the geometry of the reticle and exposure fields, these reticle thermal effects are in general barrel-shape distortions that can be well corrected with the available set of lens manipulators. Nevertheless node-over-node the residual overlay errors associated with thermo-mechanical reticle deformation needs further reduction since it contributes to the total onproduct overlay performance. To reduce overlay caused by reticle temperature drift, NXT1980Di includes an active cooling mechanism suppressing the reticle temperature changes during exposure significantly. Even though the reticle temperature excursions are well suppressed, residual intra-wafer overlay drift effect can still be observed. Before exposure of a wafer, reticle deformation is measured during reticle align using in-line alignment / image sensors (TIS or PARIS). This is enabled by adding alignment markers around the circumference of the image field on the reticle. The measured reticle deformations are then fed to the system control network and dynamically corrected for by making use of the available manipulators in the scanner and the projection lens. Wafer-by-wafer reticle distortion measurements are performed to accurately capture the transient dynamics present in reticle heating during normal production lots. A new version of Reticle Heating Feed-forward Control (RHC2) is introduced that uses reticle-heating-induced deformation measurements over time and exposure sequence information to calibrate reticle-deformation-predictionmodels. These models are based on thermo-mechanical models that simulate reticle deformation under various exposure conditions and are applied in-line to the exposures to reduce intra-wafer overlay drift effects.

Proceedings Article | 24 March 2017 Presentation + Paper

Layout independent leveling (LIL) on NXT:1980Di immersion scanners for enhanced productivity

Bram van Hoof, Arjan Holscher, Ralf Gommers, Jeroen Cottaar, Marcel Raas, Samah Khalek, Jan van Kemenade, Maarten Voncken, Roelof de Graaf, Elliot Oti, Stefan Weichselbaum, Richard Droste, ByeongSoo Lee, Chansam Chang, Young Seog Kang, Young Ha Kim, Jeong-Heung Kong, Jong Hoon Jang, YoungSun Nam, Hyunwoo Hwang

Proceedings Volume 10147, 101471A (2017) https://doi.org/10.1117/12.2259794

KEYWORDS: Semiconducting wafers, Sensors, Time metrology, Scanners, Optical alignment, Calibration, Wafer testing, Overlay metrology, Metrology, Computer programming

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Proceedings Article | 15 March 2016 Paper

Improvement of unbalanced illumination induced telecentricity within the exposure slit

Jonghoon Jang, ByeongSoo Lee, Young Seog Kang, Chansam Chang, Jeong-Heung Kong, Young Ha Kim, Wim Bouman, Roelof de Graaf, Stefan Weichselbaum, Richard Droste, Wim de Boeij, Bart van Bussel, Patrick Neefs, Arij Rijke

Proceedings Volume 9780, 97800X (2016) https://doi.org/10.1117/12.2220588

KEYWORDS: Lithography, Lithographic illumination, Optical alignment, Scanners, Optical lithography, Image enhancement, Reticles, Electronics

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Proceedings Article | 15 March 2016 Paper

Overcoming low-alignment signal contrast induced alignment failure by alignment signal enhancement

Byeong Soo Lee, Young Ha Kim, Hyunwoo Hwang, Jeongjin Lee, Jeong Heung Kong, Young Seog Kang, Bart Paarhuis, Haico Kok, Roelof de Graaf, Stefan Weichselbaum, Richard Droste, Christopher Mason, Igor Aarts, Wim de Boeij

Proceedings Volume 9780, 97800B (2016) https://doi.org/10.1117/12.2220587

KEYWORDS: Optical alignment, Signal processing, Overlay metrology, Optical lithography, Optics manufacturing, Opacity, Materials processing, Sensors, Wafer testing, Near infrared, Image processing

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Proceedings Article | 26 March 2015 Paper

Wafer to wafer overlay control algorithm implementation based on statistics

Byeong Soo Lee, Young Seog Kang, Jeong Heung Kong, Hyun Woo Hwang, Myeong Gyu Song

Proceedings Volume 9426, 942614 (2015) https://doi.org/10.1117/12.2086936

KEYWORDS: Semiconducting wafers, Logic, Reticles, Overlay metrology, Control systems, Statistical analysis, Process control, Electronics, Optical alignment, Optical lithography

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