Open Access
31 March 2022 Review of essential use of fluorochemicals in lithographic patterning and semiconductor processing
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Abstract

We identify and describe categories of fluorochemicals used to produce advanced semiconductors within the lithographic patterning manufacturing processes. Topics discussed include the per- and polyfluoroalkyl substance (PFAS) materials used and their necessary attributes for successful semiconductor manufacturing, consisting of photoacid generators, fluorinated polyimides, poly(benzoxazole)s, antireflection coatings, topcoats, and embedded barrier layers, fluorinated surfactants, and materials for nanoimprint lithography. In particular, an explanation is given of the particular function that these PFAS materials contribute. It is noted that in almost all cases fluorine-free alternatives are very unlikely to provide the essential properties present in PFAS systems. Nonfluorinated alternative compounds are discussed where available. Finally, a summary table is provided listing the families of materials discussed, the critical purpose served, what the PFAS compound provides, and the prospects for alternatives.

CC BY: © The Authors. Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.
Christopher K. Ober, Florian Kafer, and Jingyuan Deng "Review of essential use of fluorochemicals in lithographic patterning and semiconductor processing," Journal of Micro/Nanopatterning, Materials, and Metrology 21(1), 010901 (31 March 2022). https://doi.org/10.1117/1.JMM.21.1.010901
Received: 21 January 2022; Accepted: 3 March 2022; Published: 31 March 2022
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CITATIONS
Cited by 8 scholarly publications.
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KEYWORDS
Photoresist materials

Fluorine

Lithography

Optical lithography

Polymers

Semiconductor manufacturing

Refractive index

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