0.33 NA EUV systems for high-volume manufacturing

Christophe Smeets; Guido Salmaso; Joe Carbone; Marcel Mastenbroek; Nico Benders; Roderik van Es; Roelof de Graaf

doi:10.1117/12.2614220

13 June 2022 0.33 NA EUV systems for high-volume manufacturing

Christophe Smeets, Guido Salmaso, Joe Carbone, Marcel Mastenbroek, Nico Benders, Roderik van Es, Roelof de Graaf

Proceedings Volume PC12051, Optical and EUV Nanolithography XXXV; PC1205103 (2022) https://doi.org/10.1117/12.2614220
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Abstract

ASML NXE:3400 scanners are now commonly used for High Volume Manufacturing (HVM) of 7nm and 5nm logic devices as well as D1z memory devices. In 2021, ASML has introduced the NXE:3600D scanner to the market, targeting 3nm logic and D1a and D1b nodes. In this paper we will share the latest performance of these systems, including excellent overlay, critical dimension (CD) control, stability, reliability, and high productivity. Furthermore, we will address the ASML roadmap for meeting the requirements for the 2 nm node and beyond.

Conference Presentation

Citation Download Citation

Christophe Smeets, Guido Salmaso, Joe Carbone, Marcel Mastenbroek, Nico Benders, Roderik van Es, and Roelof de Graaf "0.33 NA EUV systems for high-volume manufacturing", Proc. SPIE PC12051, Optical and EUV Nanolithography XXXV, PC1205103 (13 June 2022); https://doi.org/10.1117/12.2614220

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