EUV lithography: progress, challenges, and outlook

S. Wurm

doi:10.1117/12.2076766

17 October 2014 EUV lithography: progress, challenges, and outlook

S. Wurm

Proceedings Volume 9231, 30th European Mask and Lithography Conference; 923103 (2014) https://doi.org/10.1117/12.2076766
Event: 30th European Mask and Lithography Conference, 2014, Dresden, Germany

Abstract

Extreme Ultraviolet Lithography (EUVL) has been in the making for more than a quarter century. The first EUVL production tools have been delivered over the past year and chip manufacturers and suppliers are maturing the technology in pilot line mode to prepare for high volume manufacturing (HVM). While excellent progress has been made in many technical and business areas to prepare EUVL for HVM introduction, there are still critical technical and business challenges to be addressed before the industry will be able to use EUVL in HVM.

Citation Download Citation

S. Wurm "EUV lithography: progress, challenges, and outlook", Proc. SPIE 9231, 30th European Mask and Lithography Conference, 923103 (17 October 2014); https://doi.org/10.1117/12.2076766

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