Silicon-Added Bilayer Resist (SABRE) System

William C. McColgin; Robert C. Daly; Joseph Jech Jr.; Thomas B. Brust

doi:10.1117/12.968327

1 January 1988 Silicon-Added Bilayer Resist (SABRE) System

William C. McColgin, Robert C. Daly, Joseph Jech Jr., Thomas B. Brust

Proceedings Volume 0920, Advances in Resist Technology and Processing V; (1988) https://doi.org/10.1117/12.968327
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States

Abstract

A new silylated resist process has been developed that provides the advantages of trilayer photoresist processing in a simpler bilayer format. In this new process, silicon for oxygen plasma etch resistance is added to a conventional photoresist layer after it has been exposed and developed. This silylated resist image provides an etch mask for 02 RIE etching of an underlying organic planarizing layer with 15:1 selectivity, vertical profiles, and high resolution. The process is positive-working, uses conventional materials, and improves the thermal stability of the resist image.

Citation Download Citation

William C. McColgin, Robert C. Daly, Joseph Jech Jr., and Thomas B. Brust "Silicon-Added Bilayer Resist (SABRE) System", Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); https://doi.org/10.1117/12.968327

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