Performance-based metrology of critical device performance parameters for in-line non-contact high-density intra-die monitor/control on a 32nm SOI advanced logic product platform

Mario M. Pelella; Anda C. Mocuta; Birk Lee; Noah Zamdmer; Dustin K. Slisher; Xiaojun Yu; James S. Vickers; Yota Tsuruta; Subramanian S. Iyer; Nader Pakdaman

doi:10.1117/12.2025869

10 April 2013 Performance-based metrology of critical device performance parameters for in-line non-contact high-density intra-die monitor/control on a 32nm SOI advanced logic product platform

Mario M. Pelella, Anda C. Mocuta, Birk Lee, Noah Zamdmer, Dustin K. Slisher, Xiaojun Yu, James S. Vickers, Yota Tsuruta, Subramanian S. Iyer, Nader Pakdaman

Author Affiliations +

Proceedings Volume 8681, Metrology, Inspection, and Process Control for Microlithography XXVII; 86813F (2013) https://doi.org/10.1117/12.2025869
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

We report a strong direct correlation (above 0.9) between conventional transistor-level parametrics typically used in the industry to monitor and control intra-die variability (IDV) and a novel, non-contact performance-based metrology (PBM), technology that was integrated into an active die on a 32nm SOI advanced logic product platform. We demonstrate a PBM test structure measurement repeatability of less than 0.4%. In this work, we also demonstrate the compatibility of integrating the PBM technology into an advanced CMOS process flow with no added processing or steps, as well as its footprint scalability. The data suggests that the non-contact PBM technology meets all prerequisites for its deployment as a standard, within-product IDV monitor.

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Mario M. Pelella, Anda C. Mocuta, Birk Lee, Noah Zamdmer, Dustin K. Slisher, Xiaojun Yu, James S. Vickers, Yota Tsuruta, Subramanian S. Iyer, and Nader Pakdaman "Performance-based metrology of critical device performance parameters for in-line non-contact high-density intra-die monitor/control on a 32nm SOI advanced logic product platform", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86813F (10 April 2013); https://doi.org/10.1117/12.2025869

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