Paper
8 November 2012 Choosing the data flow paradigm for EUV mask process corrections
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Abstract
When compared to conventional chrome absorber masks, electron beam patterning of EUV masks requires additional corrections to account for electron backscattering from the mirror and tantalum (Ta) based absorber layers. Current ebeam systems cannot correct for these additional backscattering effects with in-tool proximity effect correction (PEC) algorithms. Hence new methods of correction are needed, which require an implementation of the correction into the mask writer data prior to exposure. Where these corrections should be performed in the data flow between mask user and mask supplier, and who should calibrate and maintain the corrections is not clear. We present various approaches for model calibration as well as discuss the possible options for inserting mask process correction (MPC) into the mask process landscape. We report on an attempt to calibrate a correction for EUV masks using actual CD data, and an e-beam backscattering model. The resulting Point Spread Functions (PSF) were used to simulate and predict the measured CD data. We also explored the robustness of these models by varying the writing tool and mask blank characteristics. We conclude by recommending an appropriate flow for calibration and use of mask process correction and ownership of the model calibration, maintenance and the data correction processes.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christian Bürgel, Keith Standiford, and Gek Soon Chua "Choosing the data flow paradigm for EUV mask process corrections", Proc. SPIE 8522, Photomask Technology 2012, 85220Y (8 November 2012); https://doi.org/10.1117/12.965225
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KEYWORDS
Photomasks

Optical proximity correction

Data modeling

Calibration

Data conversion

Manufacturing

Point spread functions

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