Novel applications of sub-surface laser machining

B. R. Campbell; L. A. Forster; D. M. Bernot

doi:10.1117/12.876050

21 February 2011 Novel applications of sub-surface laser machining

B. R. Campbell, L. A. Forster, D. M. Bernot

Proceedings Volume 7920, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVI; 79200T (2011) https://doi.org/10.1117/12.876050
Event: SPIE LASE, 2011, San Francisco, California, United States

Abstract

Lasers can uniquely be used to create physical changes inside a bulk material. Traditional manufacturing processes are limited to surface modifications, but a laser can be focused at any location inside a material transparent to that wavelength. Using sub surface machining methods with ultrashort pulse lasers two practical applications are demonstrated. First, a laser is used to sever short-circuited wires embedded deep inside a thick piece of glass, effectively repairing a defective wire network. Second, subsurface bar-coding was shown to produce readable markings. Surface laser markings were shown to weaken the glass, but subsurface marking had virtually no effect on strength.

Citation Download Citation

B. R. Campbell, L. A. Forster, and D. M. Bernot "Novel applications of sub-surface laser machining", Proc. SPIE 7920, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVI, 79200T (21 February 2011); https://doi.org/10.1117/12.876050

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