Paper
12 March 2009 Statistical approach to design DRAM bitcell considering overlay errors
Yu-Jin Pyo, Dae-Wook Kim, Jai-Kyun Park, Ji-Seong Doh, Hyun-Jae Kang, Ji-Suk Hong, Chul-Hong Park, Sang-Hoon Lee, Moon-Hyun Yoo
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Abstract
Overlay performance and control requirements have become crucial for achieving high yield and reducing rework process. Increasing discrepancy between hardware solutions and overlay requirements, especially in sub-40nm dynamic random access memory (DRAM) devices, motivates us to study process budgeting techniques and reasonable validation methods. In this paper, we introduce a SMEM (Statistical process Margin Estimation Method) to design the DRAM cell architecture which considers critical dimension (CD) and overlay variations in the perspectives of both cell architecture and manufacturability. We also proposed the method to determine overlay specifications. Using the methodologies, we obtained successfully optimized sub-40 DRAM cells which accurately estimated process tolerances and determined overlay specifications for all layers.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yu-Jin Pyo, Dae-Wook Kim, Jai-Kyun Park, Ji-Seong Doh, Hyun-Jae Kang, Ji-Suk Hong, Chul-Hong Park, Sang-Hoon Lee, and Moon-Hyun Yoo "Statistical approach to design DRAM bitcell considering overlay errors", Proc. SPIE 7275, Design for Manufacturability through Design-Process Integration III, 72751L (12 March 2009); https://doi.org/10.1117/12.815341
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KEYWORDS
Overlay metrology

Surface plasmons

Critical dimension metrology

Statistical analysis

Manufacturing

Resistance

Error analysis

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