Paper
15 May 2008 Uncooled VOx thermal imaging systems at BAE Systems
Richard Blackwell, Daniel Lacroix, Tuyet Bach, Jonathan Ishii, Sandra Hyland, Jeannie Geneczko, Sherman Chan, Balwinder Sujlana, Mike Joswick
Author Affiliations +
Abstract
BAE Systems has advanced its 17 μm pitch LWIR 640 x 480 microbolometer technology with improvements in pixel performance and introduction of a new 17 μm pitch ROIC. We have fabricated, characterized, and demonstrated high-yielding 17 μm pitch FPAs using our new ROIC, and have successfully demonstrated them at the system level. This new technology builds on our 28 μm FPA production experience and implements our high-performance single-level microbolometer process at 17 μm pitch. We present initial results and imagery. These 17 μm FPAs have exceptional performance and provide the path to next generation microbolometer applications.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard Blackwell, Daniel Lacroix, Tuyet Bach, Jonathan Ishii, Sandra Hyland, Jeannie Geneczko, Sherman Chan, Balwinder Sujlana, and Mike Joswick "Uncooled VOx thermal imaging systems at BAE Systems", Proc. SPIE 6940, Infrared Technology and Applications XXXIV, 694021 (15 May 2008); https://doi.org/10.1117/12.783931
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Cited by 20 scholarly publications.
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KEYWORDS
Readout integrated circuits

Staring arrays

Semiconducting wafers

Imaging systems

Microbolometers

Long wavelength infrared

Standards development

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