Paper
11 January 2007 Modelling of coplanar waveguide transmission lines in multiple metal layer processes
Author Affiliations +
Proceedings Volume 6414, Smart Structures, Devices, and Systems III; 64141R (2007) https://doi.org/10.1117/12.695676
Event: SPIE Smart Materials, Nano- and Micro-Smart Systems, 2006, Adelaide, Australia
Abstract
Accurate characterisation of transmission lines is essential in enabling the design of Monolithic Microwave Integrated Circuits (MMICs) or Radio Frequency Integrated Circuits (RFICs). One RFIC technology currently being pursued is Silicon on Sapphire Complementary Metal Oxide Semiconductor (CMOS) technology. CMOS processes typically involve stacked metal layer structures and the correct method of modelling coplanar waveguides in CMOS is unclear. This paper reports on preliminary studies into electromagnetic design, with an emphasis on correctly predicting losses associated with these structures.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
E. Heading, H. J. Hansen, and M. E. Parker "Modelling of coplanar waveguide transmission lines in multiple metal layer processes", Proc. SPIE 6414, Smart Structures, Devices, and Systems III, 64141R (11 January 2007); https://doi.org/10.1117/12.695676
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KEYWORDS
Metals

Signal attenuation

Device simulation

Modeling

Waveguides

Computer aided design

Electromagnetism

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