Paper
15 March 2006 Application of super-diffraction lithography (SDL) for an actual device fabrication
Shuji Nakao, Shinroku Maejima, Itaru Kanai, Akihiro Nakae, Junjiro Sakai, Koichiro Narimatsu, Kazuyuki Suko
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Abstract
A novel RET, "Super Diffraction Lithography" (SDL), which enable 70 nm any pitch line by single exposure in KrF wavelength, has been studied in order to apply for an actual device pattern formation. In a previous work, the concept of SDL has been described with optical image calculations for 1-dimensional patterns and very superior performance has been proved. In this work, imaging characteristics and printing performance of typical 2-dimension patterns are investigated by optical image calculations and printing experiments to realize an application of SDL technique to fabrication of actual device patterns. As a result, very good performance is achieved for the typical 2-dimentional patterns such as line-end, tee-branch. Moreover, good performance is obtained for general SRAM patterns and standard cell of 65 nm node logic device with a little relaxation of design rule. In conclusion, by the application of SDL, 65 nm SoC patterns with a little relaxed design can be formed by single exposure process in KrF wavelength with a simple Atten-PSM. Then, huge cost reduction can be expected by application of SDL.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shuji Nakao, Shinroku Maejima, Itaru Kanai, Akihiro Nakae, Junjiro Sakai, Koichiro Narimatsu, and Kazuyuki Suko "Application of super-diffraction lithography (SDL) for an actual device fabrication", Proc. SPIE 6154, Optical Microlithography XIX, 61542A (15 March 2006); https://doi.org/10.1117/12.656043
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KEYWORDS
Photomasks

Critical dimension metrology

Printing

Photography

Lithography

Scanning electron microscopy

Optical proximity correction

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