Paper
28 June 2005 Novel acid-free cleaning process for mask blanks
Harald Koster, Karsten Branz, Uwe Dietze, Peter Dress, Guenter Hess
Author Affiliations +
Abstract
Knowledge of particle removal during the mask cleaning was transferred to the blank cleaning and vice versa. The experiments are focusing on a variety of blank substrates (glass substrates, chrome on glass blanks and phase shift mask blanks substrates). The principal equipment concept and the process optimization strategies for cleaning of those different kinds of blank substrates are presented. With a fixed process flow, including UV-treatment, Fulljet and MegaSonic treatment, Rinse and Dry, process parameters are varied to define the optimum process conditions. Criteria for an optimum process are particle removal efficiency in general and optical integrity for phase shift mask blanks in particular. The particle removal efficiency for all investigated blank types is within a range of 96-100%. Especially for Ta/SiO2 phase shift mask blanks we demonstrate that during the cleaning process the optical properties only change by 0.07° phase loss and 0.01% transmission loss per cleaning cycle, respectively.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Harald Koster, Karsten Branz, Uwe Dietze, Peter Dress, and Guenter Hess "Novel acid-free cleaning process for mask blanks", Proc. SPIE 5853, Photomask and Next-Generation Lithography Mask Technology XII, (28 June 2005); https://doi.org/10.1117/12.617115
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KEYWORDS
Particles

Glasses

Etching

Phase shifts

Photomasks

Contamination

Inspection

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