WAMA: a method of optimizing reticle/die placement to increase litho cell productivity

Amos Dor; Yoram Schwarz

doi:10.1117/12.584775

5 May 2005 WAMA: a method of optimizing reticle/die placement to increase litho cell productivity

Amos Dor, Yoram Schwarz

Proceedings Volume 5756, Design and Process Integration for Microelectronic Manufacturing III; (2005) https://doi.org/10.1117/12.584775
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

This paper focuses on reticle/field placement methodology issues, the disadvantages of typical methods used in the industry, and the innovative way that the WAMA software solution achieves optimized placement. Typical wafer placement methodologies used in the semiconductor industry considers a very limited number of parameters, like placing the maximum amount of die on the wafer circle and manually modifying die placement to minimize edge yield degradation. This paper describes how WAMA software takes into account process characteristics, manufacturing constraints and business objectives to optimize placement for maximum stepper productivity and maximum good die (yield) on the wafer.

Citation Download Citation

Amos Dor and Yoram Schwarz "WAMA: a method of optimizing reticle/die placement to increase litho cell productivity", Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); https://doi.org/10.1117/12.584775

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