A Process Evaluation Of Gaf Microline Photoresist - PR 102

Chris Ladas

doi:10.1117/12.954242

1 March 1974 A Process Evaluation Of Gaf Microline Photoresist - PR 102

Chris Ladas

Proceedings Volume 0055, Technological Advances in Micro and Submicro Photofabrication Imagery; (1974) https://doi.org/10.1117/12.954242
Event: Acquisition and Analysis of Pictorial Data, 1974, San Diego, United States

Abstract

Increasing demands for minimizing defect density in wafer processing have resulted in a significant emphasis on non-contact printing of the photoresist using either a proximity or projection mode of align-ment. Correspondingly, the need for shrinking geometry sizes to increase packing density and improve device performance is very important in coping with the complexity of LSI devices.

Citation Download Citation

Chris Ladas "A Process Evaluation Of Gaf Microline Photoresist - PR 102", Proc. SPIE 0055, Technological Advances in Micro and Submicro Photofabrication Imagery, (1 March 1974); https://doi.org/10.1117/12.954242

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