Scanning wafer thickness and flatness interferometer

Maarten J. Jansen; Han Haitjema; Peter H.J. Schellekens

doi:10.1117/12.515650

26 February 2004 Scanning wafer thickness and flatness interferometer

Maarten J. Jansen, Han Haitjema, Peter H.J. Schellekens

Proceedings Volume 5252, Optical Fabrication, Testing, and Metrology; (2004) https://doi.org/10.1117/12.515650
Event: Optical Systems Design, 2003, St. Etienne, France

Abstract

Since the wafer industry is using an increasing amount of double side polished wafers, the future of wafer metrology is very likely to shift from capacitance gauging techniques to optical measurement techniques. Participating in an international project the Technical University of Eindhoven is developing a self calibrating, traceable double side wafer flatness and thickness measurement device. By using proper measurement principles and advanced software a robust and traceable wafer thickness and flatness measurement instrument is created which combines high lateral resolution, nanometer accuracy, high speed and low cost.

Citation Download Citation

Maarten J. Jansen, Han Haitjema, and Peter H.J. Schellekens "Scanning wafer thickness and flatness interferometer", Proc. SPIE 5252, Optical Fabrication, Testing, and Metrology, (26 February 2004); https://doi.org/10.1117/12.515650

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available