Paper
10 July 2003 Modification of existing chip layout for yield and reliability improvement by computer-aided design tools
Mu-Jing Li, Suryanarayana Maturi, Pankaj Dixit
Author Affiliations +
Abstract
A CAD flow has been developed to modify an existing large scale chip layout to reinforce the redundant via design rules to improve the yield and reliability. The flow operates on each metal-via pair from bottom up to correct the redundant via rule violations. It divides a large complex design into cells, so that multiple process can work concurrently as if every process were working on the top level to reach the goal in a reasonable time.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mu-Jing Li, Suryanarayana Maturi, and Pankaj Dixit "Modification of existing chip layout for yield and reliability improvement by computer-aided design tools", Proc. SPIE 5042, Design and Process Integration for Microelectronic Manufacturing, (10 July 2003); https://doi.org/10.1117/12.504322
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Metals

Computer aided design

Reliability

Yield improvement

Astatine

Copper

Lithium

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