Complete monitoring strategy to quantify matching and performance for multiple CDSEM in advanced fab

Pey-Yuan Lee; Chi-Shen Lo; Yi-Hung Chen; Thomas Teng; Steven Fu; Mico Chu; Jason C. Yee

doi:10.1117/12.485227

15 July 2003 Complete monitoring strategy to quantify matching and performance for multiple CDSEM in advanced fab

Pey-Yuan Lee, Chi-Shen Lo, Yi-Hung Chen, Thomas Teng, Steven Fu, Mico Chu, Jason C. Yee

Proceedings Volume 5041, Process and Materials Characterization and Diagnostics in IC Manufacturing; (2003) https://doi.org/10.1117/12.485227
Event: Advanced Microelectronic Manufacturing, 2003, Santa Clara, CA, United States

Abstract

We will present a complete example that demonstrates daily CD monitor for good CDSEM control, including sampling plan, monitoring procedure, and monitoring and matching data for multiple CDSEM. In addition, we also investigate two methods to address the carbon contamination problem. In the first method, carryover trends on three different film stacks, poly, metal, and multi-layer metal, before and after plasma clean are compared in search of ways to minimize carryover. The second method applies statistical treatment to remove the effect of carryover while maintaining sensitivity over small fluctuations in line CD monitor results. Both linear regression and exponentially weighed moving average calculated from daily monitor data are used to model the baseline carryover trend for the purpose of isolating tru tool variability. Using this method, we can easily quantify the long-term stability of each CDSEM, and with that, we are able to calculate the true long-term process variation Cp by subtracting the CDSEM variation component from the observed total Cp.

Citation Download Citation

Pey-Yuan Lee, Chi-Shen Lo, Yi-Hung Chen, Thomas Teng, Steven Fu, Mico Chu, and Jason C. Yee "Complete monitoring strategy to quantify matching and performance for multiple CDSEM in advanced fab", Proc. SPIE 5041, Process and Materials Characterization and Diagnostics in IC Manufacturing, (15 July 2003); https://doi.org/10.1117/12.485227

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