Paper
12 June 2003 Novel laser ablation patterning with organic film in running water
Shinichi Ito, Hiroshi Ikegami, Kenji Kawano, Tomoyuki Takeishi, Nobuo Hayasaka, Masayoshi Kobayashi, Tetsuya Hamamoto, Yoichi Ogawa, Naoto Yoshitaka, Shoichi Terada
Author Affiliations +
Abstract
In the tri-level resist process, it is sometimes difficult to detect the alignment mark because of the anti-reflection performance of the organic thick anti-reflective (ARL). Laser ablation in running water was one of the most effective techniques for removing the organic thick ARL on the alignment mark. Generally, the ablation process produces many particles. The results of our experiment indicate that the particle distribution area greatly depends on the dome-shape bubble on the ablation area. The particle distribution area could be minimized by optimizing some ablation conditions according to the estimated size of the dome-shape bubble. By optimizing a shift of the narrow slit-laser-beam and its energy so as to keep the ablation/initial thickness ratio to less than 20%, fine ablation area could be obtained. This novel ablation technique is very useful for particle-free selective removal of the organic thick ARL film.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shinichi Ito, Hiroshi Ikegami, Kenji Kawano, Tomoyuki Takeishi, Nobuo Hayasaka, Masayoshi Kobayashi, Tetsuya Hamamoto, Yoichi Ogawa, Naoto Yoshitaka, and Shoichi Terada "Novel laser ablation patterning with organic film in running water", Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); https://doi.org/10.1117/12.485045
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KEYWORDS
Laser ablation

Particles

Photoresist processing

Optical lithography

Cameras

Optical alignment

Thin films

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