Photolithography For Integrated Thin Film Read/Write Heads

J.-S. Gau

doi:10.1117/12.953179

25 July 1989 Photolithography For Integrated Thin Film Read/Write Heads

J.-S. Gau

Proceedings Volume 1088, Optical/Laser Microlithography II; (1989) https://doi.org/10.1117/12.953179
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

The lithographic processes involved in the fabrication of thin film heads are discussed. Because of the intrinsic features of huge topography and high aspect ratio, process requirements for film heads as opposed to semiconductor devices are identified. A process of conformal thick resist coating across a large step height is developed by optimizing resist coating parameters and the use of a resist with higher viscosity. Also planarization techniques are discussed with a specific example illustrated to planarize the topography associated with the fine and large cross-sectional coil pattern. Alignment accuracy proves to be the most critical parameter for further advances in the film head technology and several strategies are proposed to improve the alignment capability.

Citation Download Citation

J.-S. Gau "Photolithography For Integrated Thin Film Read/Write Heads", Proc. SPIE 1088, Optical/Laser Microlithography II, (25 July 1989); https://doi.org/10.1117/12.953179

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