MEMS packaging efforts at Sandia National Laboratories

Jonathan S. Custer

doi:10.1117/12.476331

16 January 2003 MEMS packaging efforts at Sandia National Laboratories

Jonathan S. Custer

Proceedings Volume 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II; (2003) https://doi.org/10.1117/12.476331
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

Sandia National Laboratories has programs covering a broad range of MEMS technologies from LIGA to bulk to surface micromachining. These MEMS technologies are being considered for an equally broad range of applications, including sensors, actuators, optics, and microfluidics. As these technologies have moved from the research to the prototype product stage, packaging has been required to develop new capabilities to integrated MEMS and other technologies into functional microsystems. This paper discusses several of Sandia’s MEMS packaging efforts, focusing mainly on inserting Sandia’s SUMMiT V (5-level polysilicon) surface micromachining technology into fieldable microsystems.

Citation Download Citation

Jonathan S. Custer "MEMS packaging efforts at Sandia National Laboratories", Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); https://doi.org/10.1117/12.476331

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