FEA modeling of a thermally excited silicon-beam resonant pressure sensor

Deyong Chen; Dafu Cui; Li Wang; Zhongyao Yu; Zheng Cui; Shanhong Xia

doi:10.1117/12.440192

14 September 2001 FEA modeling of a thermally excited silicon-beam resonant pressure sensor

Deyong Chen, Dafu Cui, Li Wang, Zhongyao Yu, Zheng Cui, Shanhong Xia

Proceedings Volume 4414, International Conference on Sensor Technology (ISTC 2001); (2001) https://doi.org/10.1117/12.440192
Event: International Conference on Sensing units and Sensor Technology, 2001, Wuhan, China

Abstract

FEA modeling of a thermally-excited silicon beam resonant pressure sensor is presented. The sensor consists of two bonded silicon chips, one with an etched beam and another with an etched diaphragm. FEA modeling is carried out on temperature distribution, resonant frequency shift due to thermal stress, effect of heater/detector elements on the natural resonance frequency, design of diaphragm geometry, and sensitivity of pressure measurement. The resonant pressure sensor samples are realized by silicon micromachining are measured. There is a satisfactory agreement between theory and experiments.

Citation Download Citation

Deyong Chen, Dafu Cui, Li Wang, Zhongyao Yu, Zheng Cui, and Shanhong Xia "FEA modeling of a thermally excited silicon-beam resonant pressure sensor", Proc. SPIE 4414, International Conference on Sensor Technology (ISTC 2001), (14 September 2001); https://doi.org/10.1117/12.440192

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available