Paper
5 July 2000 Issues and nonissues on a 193-nm step-and-scan system in production
Jeff A. Schefske, Eric Kent, Uzodinma Okoroanyanwu, Harry J. Levinson, Charles R. Masud, Bob Streefkerk, Ralph M. Hanzen, Joerg Brueback
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Abstract
With the delivery of 193nm exposure tool to several production fabs in the past year, we are now able to identify potential issues with this technology. For 193 nm lithoghpray, lifetime issues associated with the optical elements have been a big concern in the industry. Early learnings of optical component lifetimes for a 193nm step- and-scan system in pilot lien operation are reviewed. The performance and stability of line-narrowed ArF excimer lasers have also been unknowns in a production fab until now. High voltage and pulse length trends on the ArF laser are discussed. Data for lens heating effects on focus is presented. Stray light data will also be included in this paper. Observations related to the practical operation of a 193nm exposure tool as well as 193nm specific error modes will be shared. Finally, key areas where improvement is needed to ensure that 193nm lithography will be a cost- effective manufacturing technology are identified.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeff A. Schefske, Eric Kent, Uzodinma Okoroanyanwu, Harry J. Levinson, Charles R. Masud, Bob Streefkerk, Ralph M. Hanzen, and Joerg Brueback "Issues and nonissues on a 193-nm step-and-scan system in production", Proc. SPIE 4000, Optical Microlithography XIII, (5 July 2000); https://doi.org/10.1117/12.389035
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KEYWORDS
193nm lithography

Stray light

Semiconducting wafers

Chlorine

Reliability

Lithography

Optical components

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