Wafer bonding with an adhesive coating

Gerhard Klink; Bernhard Hillerich

doi:10.1117/12.323903

8 September 1998 Wafer bonding with an adhesive coating

Gerhard Klink, Bernhard Hillerich

Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323903
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States

Abstract

The assembly process for microelectromechanical systems often requires a wafer-joining process using low temperatures. In this work a bonding process investigated, which uses thin adhesive films to stack silicon wafers. The method can be extended to form patterned adhesive coatings using stamping technique. Characterization of the process has been carried out with respect to adhesion, hermeticity and chemical stability of the adhesive bond. In several applications this adhesive bonding process has been successfully applied to assemble sensors and actuators.

Citation Download Citation

Gerhard Klink and Bernhard Hillerich "Wafer bonding with an adhesive coating", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); https://doi.org/10.1117/12.323903

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