Paper
29 June 1998 Effects of a visualization dye in a thick film photoresist
Kathryn H. Jensen, Stanley A. Ficner
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Abstract
The development of a dyed thick film photoresist for visualization purposes is described. The need for a visualization dye for residual resist (the coil layers) is a possible requirement for the thin film head fabrication technology. Because of the high transparency of the photoresist used in the production of magnetic read/write devices, it may be desirable for a dye to improve visualization properties. A method is described in which a dyed thick film photoresist is developed. Performance requirements are discussed and a lithographic evaluation is given. Assessment of the formulations were carried out on an UltratechTM stepper using a current production photoresist as a standard. It is necessary to maintain resist performance such as photospeed, resolution capabilities, and depth of focus. Advantages and disadvantages are presented for the dyed thick film photoresist. Also included is a discussion concerning the critical factor of dye concentration present within the photoresist.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kathryn H. Jensen and Stanley A. Ficner "Effects of a visualization dye in a thick film photoresist", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312431
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Cited by 1 scholarly publication.
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KEYWORDS
Photoresist materials

Visualization

Lithography

Optical inspection

Inspection

Photoresist developing

Semiconducting wafers

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