Board-level clock distribution using laminated end-tapered fiber bundles

Yao Li; Jan Popelek; Ting Wang; June-Koo Rhee; Lijun J. Wang

doi:10.1117/12.307564

5 May 1998 Board-level clock distribution using laminated end-tapered fiber bundles

Yao Li, Jan Popelek, Ting Wang, June-Koo Rhee, Lijun J. Wang

Proceedings Volume 3288, Optoelectronic Interconnects V; (1998) https://doi.org/10.1117/12.307564
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

Embedding of end-tapered, thin-cladding fiber bundles for board- level large bandwidth optical clock distribution is proposed and implemented. Fan-outs of 1 to 64- and 128-nodes on a printed circuit board of area 13 X 9 cm² are experimentally demonstrated. Dispersion measurement shows a 30 picosecond pulse broadening over 30 cm length of the fiber, thereby indicating multi Gb/s clock delivery capability. Power coupling efficiency of 3 dB with coupling nonuniformity of 4.7 - 5.5 dB is observed.

Citation Download Citation

Yao Li, Jan Popelek, Ting Wang, June-Koo Rhee, and Lijun J. Wang "Board-level clock distribution using laminated end-tapered fiber bundles", Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); https://doi.org/10.1117/12.307564

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